- Description
- Options
- Consultation
The AJA’s ATC Orion Series magnetron sputtering system is one compact PVD system which belongs to the ATC Flagship Series and highly cost effective. All Orion Series’ HV and UHV sputtering systems incorporates with many ATC’s mature designs and general options. Commonly, there are stocks of standard ATC Orion’s components (chamber, framework, cluster flange, etc.), so the delivery time of the system can be effectively shortened.
There is one special version of Orion 8 which can integrate 4 magnetron sputtering sources at 2" diameter and allow in-situ tilt. ATC Orion series sputtering systems can be easily connected to each other or other ATC systems. Due to such connection(s), there are multi-chamber (eg. steel/oxide)or multi-function systems (eg. sputtering/evaporation/PLD/ion beam milling).
Main Characteristics
l 5/8 co-sputtering sources incorporated
l Up/down sputtering orientation
l Deposition uniformity: +/-2.5%@4"(100mm) substrate
l Substrate holder: heating, cooling(LN2/H2O); DC/RF bias
l DC, RF, Pulsed DC and HiPMS generators, etc. as options
l 4-way gas lines (Ar, O2, N2, H2) incorporated
l Load-lock options
l Computer/semi-auto control
l HV/UHV
Specifications
|
Technical Parameters |
Standard ORION 5 Series |
Standard ORION 8 Series |
|
Deposition Chamber |
304 stainless steel chamber |
304 stainless steel chamber |
|
Number of Sputtering Sources |
5 sources of 2" |
8 sources of 2" |
|
Sputtering Orientation |
Up / Down |
Up / Down |
|
Substrate Holder |
Up to 4" substrate can be held Electric rotary mechanism Working distance with up and down adjustment RF bias as an option |
Up to 6" substrate can be held Electric rotary mechanism Working distance with up and down adjustment RF bias as an option |
|
Temperature |
850℃ |
850℃ |
|
Process Gases |
4 gas lines (Ar, O2, N2, H2) |
4 gas lines (Ar, O2, N2, H2) |
|
Generators |
DC, RF, Pulsed DC and HIPMS generators, etc. |
DC, RF, Pulsed DC and HIPMS generators, etc. |
|
Load-Lock |
Single-/Multi-wafer transfer |
Single-/Multi-wafer transfer |
|
Vacuum System |
Molecular pump/cryogenic pump |
Molecular pump/cryogenic pump |
|
Computer Control |
Software, Labview based |
Software, Labview based |
|
Deposition Uniformity |
Better than ±2.5% |
Better than ±2.5% |
|
Base Vacuum |
Better than 5×10-8Torr |
Better than 5×10-8Torr |
|
Custom Supported？ |
YES |
YES |
