Magnetron Sputtering 磁控溅射系统

• Economical Table Magnetron Sputtering System

  

  Economically Table Sputtering System

  Integration up to 5 con-focal sputtering targets at 1.5"

  Up/down sputtering orientation

  Deposition uniformity:+/-2.5%@3"(75mm) substrate

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• ATC ORION Series Magnetron Sputtering System

  

  The AJA’s ATC Orion Series magnetron sputtering system is one compact PVD system which belongs to the ATC Flagship Series and highly cost effective. All Orion Series’ HV and UHV sputtering systems incorporates with many ATC’s mature designs and general options. Commonly, there are stocks of standard ATC Orion’s components (chamber, framework, cluster flange, etc.), so the delivery time of the system can be effectively shortened.

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• ATC FLAGSHIP Magnetron Sputtering System

  

  AJA’s ATC Flagship Series sputtering system is a muti-functional PVD system which can satisfy different needs through different configuration. Different configurations are based on AJA unique A300-XP (UHV) or Stiletto series (HV) magnetron sputtering sources which supports in-situ tilt. Because of this function, accurate and repeatable con-focal sputtering, direct sputtering and off-axis sputtering can be achieved. All systems are mated with heavy-duty hydraulic crane mechanism. It’s easy for opening the lid on the chamber top.

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• ATC-B Series Batch Coating System

  

  AJA’s ATC-B Series Batch Coating systems are sputtering and evaporation systems for customizing, which can deal with in bulk several kinds of substrates. Customers can choose cylindrical or box chamber according to their different requirements. During film growth, sputtering materials shall not get onto sputtering sources or substrates ( the “get onto” can suspend one process) which enables to increase obviously times of process in horizontal magnetron sputtering.

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• AJA Magnetron Sputtering Targets UHV & HV

  

  Since the establishment in 1991, AJA INTERNATIONAL,. INC. has produced over one hundred kinds of sputtering sources, including many custom sources. According to the geometrical shapes of substrates, chamber configuration, targets’ materials and films’ specifications, there are optional types of sources, like rectangle, circular, converter and cylinder.

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