Magnetron Sputtering 磁控溅射系统

AJA’s ATC Flagship Series sputtering systems are muti-functional PVD systems which can satisfy different needs through different configurations. Different configurations are based on AJA unique A300-XP (UHV) or Stiletto series (HV) magnetron sputtering sources which supports in-situ tilt. With this function, accurate and repeatable con-focal sputtering, direct sputtering and off-axis sputtering can be achieved. All systems are mated with heavy-duty hydraulic crane mechanism. It’s easy for opening the lid on the chamber top.

Optional Chamber sizes:

ATC 1800 (18" Ø)

ATC 2200 (22" Ø)

ATC 2600 (26" Ø)

Those powerful sputtering systems can be configured into several deposition styles (ion beam evaporation/thermal evaporation/pulsed laser deposition (PLD),accommodate ion sources, Knudsen evaporation pool (MBE system), and incorporate FTS,contact mask system, metal-sealed chamber body, insulating jacket, gloves box, substrate cassette, batch-auto-loading system and analyzers (RHEED/XPS/Auger/RGA/Ellipsometer, etc.).

The Lab-view based computer control system and turbo molecular pump/cryogenic pump can be configured in accordance with customers' application requirements. All ATC Flagship systems can be easily connected with each other or systems of ATC Orion series. Through such connections, there are multi-chamber (eg. steel/oxide)or multi-function systems (eg. sputtering/evaporation/PLD/ion beam milling/analyzer).

Main Characteristics

l Accommodate (11) 2" con-focal sputtering sources with in-situ tilt

l Ultra thin film (˂1nm) deposition, controllable deposition rates

l Uniformity better than +/-1.5% @ 4"(100mm) substrate

l Substrate holder: heat up to 1000℃, rotary(0-40RPM), RF/DC bias

l Power supplies: RF, DC, Pulsed DC and HiPIMS

l Integrate 4-way (Ar, O2, N2, H2) MFC gas lines

l Semi-automatic control or computer with Lab-View control

l Load-Lock

l HV or UHV (e10^-7 to e10^-10 Torr)

l Coating materials: metal, medium, ceramics, superconductivity, transparent conductive oxides, magnetic materials, organic materials, piezoelectric materials, etc.

l Application: magnetics, spintronics,GMR/MTJ and so on

Standard Deposition Rate & Unifomity Data

The thickness data in the above picture was measured from the SiO2 film on 150mm Silicon wafer coated by standard ATC 2200 system. The ATC 2200 System have (6) 3" A330-XP UHV magnetron sputtering sources with in-situ tilt. The uniformity of +/-1.17% at 140mm substrate can be achieved per (1) 3" source working one time	A330-XP UHV magnetron sputtering sources can be used for con-focal sputtering, be angled and evenly deposit on 150mm substrates.