- Description
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- Consultation
AJA International ATC-IM Ion Milling Systems are versatile tools which are built in a variety of configurations depending on specific requirements. In accordance characteristics of customers’ applications, the custom systems adopt substrate holders and ion sources of high performance. The sizes of chambers vary from 10" to 22" diameter. It can also be outfitted with computer control system, load-lock, auto-loading system, a multi-substrate cassette and mask exchange machanism.
These systems are featured by the unique design of milling station, which can be configured for a broad application range, from nano pattern delineation to bulk wafer planarization. The substrate holder can hold up to 8" substrate. It designed and produced on AJA’s own and there are many optional functions to satisfy market requirements, such as rotation, manual/motorized incident angle adjustment, heating, water cooling / LN2 cooling, backside gas cooling, and electrical isolation or biasing. AJA produces a large number of sources gridded or gridless and with RF bias which can be easily incorporated into corresponding systems, ilike systems for reactive or inert gas milling process. These ion sources can be configured in accordance with your requirements, directly facing substrates or in an angled position.
Standard Ion Milling System Configuration
ATC-2020-IM
Features a 14cm, gridded, RF ion source used to etch substrates with diameter up to 100mm. Besides, the system also features a 700 l/s turbo pump, computer control, SIMS endpoint detection and substrate holder with motorized tilt, rotation and water cooling.
ATC-2020-IM (internal view)
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Features a 14cm, gridded, RF ion source with hollow cathode neutralizer, 6" substrate holder with motorized / programmable +/- 90° tilt angle control, azimuthal rotation, water cooling, and SIMS end point detection. |
ATC-2036-IM
The system shown on the right is equipped with a RF 22cm gridded ion source positioned for uniform milling of a 150mm Ø substrate. System features a 2000 l/s turbopump, computer control, SIMS end point detection, (2) sputtering sources for depositing passivation layers, and substrate holder with motorized tilting, rotation, and water cooling. Etch rate is 320 Å/min of SiO2 with +/- 2% uniformity.
ATC-2036-IM with Motorized UNO
ATC-2036-IM with Motorized UNO Series Substrate Holder on Slide Mechanism AJA UNO Series Substrate Holders feature simultaneous substrate rotation, water cooling, and tilting to allow the ion beam incidence angle to be varied with precision. The unit shown above has programmable, motorized tilting (+/- 90° ) and is mounted on a retractable slide rail for easy access substrate load/unload and servicing.
ATC-1800-IM-R
Utilizing a 14cm, gridded, RF ion source for uniform, reactive milling of a 100mm Ø substrate and features a 2000 l/s turbopump, computer control, retractable faraday cup, load-lock with sputter gun for passivation layers, and a substrate holder with motorized tilting, heating/cooling (5-200°C). This tool is also compatible with Cl gas and includes a (4) MFC hazardous gas box.
Typical Milling Uniformity Data
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Typical milling profile yielding +/- 2% uniformity with SiO2 on a 6" Ø Si wafer and using an angled, gridded Kaufman style ion source. This process also utilized a rotating wafer table with helium gas backside cooling system. |
