Multi-chamers & Hybrid Multi-chamers & Hybrid

Magnetron Sputtering MOS

Deposition (electron beam and thermal evaporation) Ellipsometry

Ion Milling                            Secondary Ion Mass Spectrometry(SIMS)

Ion Beam Deposition           Rapid Thermal Anneal

Pulsed Laser Deposition     Oxygenation and Nitridization

RHEED                                XPS/AUGER/LEED Analysis

Standard Multi-Technique System Configuration

Dual ATC-Orion UHV with Common Load-Lock

System features both sputter and evaporation  process chambers with (8) A320-O 2 " UHV sputter sources, (1) 6-pocket 15cc UHV linear e-gun, (4) Resistive Thermal Sources, 850℃ rotating substrate heaters with RF bias, secondary tilting/cooled stage, RHEED, computer control, load-lock cassette with in-situ mask exchange for 4" diameter substrates and chamber to chamber transfer system. 

ATC UHV Dual Chamber

Dual UHV ATC 1800/2200E (Sputter/ E-Beam) system with (4) A320-XP 2 " UHV sputter sources with in-situ tilt, (2) 4-pocket 15cc UHV linear e-guns, RF ion source, 1200 l/s turbopumps, 850°C rotating substrate heaters with RF bias, computer control, and common vertex load-lock for 100 mm Ø substrates.  

ATC Dual Chamber with Common Cassette Load-lock

The dual sputtering system is connected by a common load-lock with (6) position cassette with "vacuum suitcase" compatibility.  The chamber on the left includes (7) fixed angle sputter sources and has a 1.0 x 10^-8 Torr base pressure.  The chamber on the right features an integral bake jacket, (4) in-situ tilt sputter sources, a gridded ion source and with an ultimate pressure at 10^-10 Torr.

ATC Dual Chamber - Sputtering/Pulsed Laser Deposition

The chamber on the right is a full featured ATC 2200 with (6) UHV sputter sources with in-situ tilt and an 850°C substrate heater with RF bias, Z motion and azimuthal rotation.  The chamber on the left connect with a laser on the back via the safety tunnel and features PLD from a six target turret.  This chamber also includes 850°C heating and high pressure, double differentially pumped RHEED.  Both are connected by a common vertex load-lock.

ATC 1800-HY

Incorporates confocal sputtering, a (6) pocket linear e-beam source, ion milling and a retractable sputter source for short working distance direct sputtering (e.g. Nb superconductors).  This UHV tool also incorporates a +/- 200° tilting substrate holder with substrate cooling and azimuthal rotation.

ATC 2030-HY

The HV box chamber features a turbo-pumped vacuum load-lock for substrates up to 6" diameter and Labview based computer control system which handles all magnetron sputtering and thermal evaporation functions and interfaces seamlessly with the Inficon Deposition Controller for e-beam operations.		Featuring a 6-pocket, 15cc rotary pocket electron beam source with shielding, (1) 2" and (2) 3"magnetron sputter sources with tilt and an 850°C substrate heater with azimuthal rotation, Z motion and RF bias.

ATC Orion 8-E-HY

This powerful tool features a linear UHV e-beam source, a 3" UHV sputter source with in-situ tilt, several different substrate carriers and a vacuum load lock.  

ATC 1800-HY

This view shows a tilting, water cooled ring which can accept a substrate carrier from and 850°C lamp heater.  The ring can be oriented for normal deposition from both sources or for shadow evaporation.		The water cooled ring at the left can be replaced by a 2" 1000°C, tilting, substrate heater with a programmable, water cooled wedge shutter for gradient film deposition.
Featuring a (6) pocket linear UHV e-beam source, a +/- 200° tilting substrate holder with azimuthal rotation and RF bias, (2) UHV sputter sources and a 4cm, gridded ion source.		This view shows AJA's unique "magnetic bayonet" transfer system.